XINYISEMI Wins the 2026 IEEE Circuits and Systems Society "Best Industry Paper Award"

From May 24 to 27, the 2026 IEEE International Symposium on Circuits and Systems (ISCAS) was grandly held at the Shanghai International Convention Center. As the flagship conference of the IEEE Circuits and Systems Society (IEEE CASS), ISCAS is recognized as the world's largest academic conference in the field of circuits and systems, serving as a premier exchange platform for researchers in theory, design, and applications. With the theme of "Circuits and Systems for Intelligent Society," this year's conference brought over 1,000 participants from 46 countries, including top scholars and industry experts.

At this conference, XINYISEMI received global international recognition. On May 26, the paper authored by XINYISEMI, titled "A Compact Cost-Effective NB-IoT System-In-Package with Integrated RF Front-End IPD and TX/RX Gain Self-Calibration," won the 2026 IEEE Circuits and Systems Industry Best Paper Award. The paper systematically presents a compact, low-cost NB-IoT System-in-Package (SiP) chip solution that integrates RF front-end IPD and incorporates TX/RX gain self-calibration technology. This solution is of great significance in reducing system bill-of-materials (BOM) costs, enhancing integration, and improving engineering manufacturability.

This award, established by the IEEE Circuits and Systems Society, recognizes outstanding industry-led technical papers based on originality, technical contribution, industrial value, and timeliness. XINYISEMI's win highlights its significant contributions in NB-IoT chips, RF front-end integration, System-in-Package (SiP), and self-calibration circuits. Notably, previous recipients include industry leaders such as NXP, underscoring the global competitiveness of XINYISEMI's breakthroughs.

Earlier, this work was presented as a live demonstration at IEEE ISICAS 2025 and won the Best Live Demo Award, proving its system integrity, silicon performance, and engineering readiness—demonstrating both academic innovation and industrial applicability.

From live demo recognition to this Industry Best Paper Award, XINYISEMI has demonstrated end-to-end capabilities in product definition, R&D, engineering, and commercialization, validating its successful transition from lab to real-world applications.

At the conference exhibition, XINYISEMI showcased a comprehensive portfolio including NB-IoT, Cat.1 bis, edge AI chips, IoT NTN, GNSS, and scenario-specific SoCs, attracting significant interest from global experts and industry visitors. Among these, edge AI and IoT NTN—the company's key strategic directions—have already achieved breakthroughs in multiple scenarios. Edge AI enables low-power intelligent decision-making on edge devices, while IoT NTN accelerates space-air-ground integrated connectivity, with both technologies entering large-scale deployment.